Chemiluminescense based analyzer for semiconductor applications - Electronics and Computers

NOx detection is an innovative approach in CMP (Chemical Mechanical Polishing) process control. CMP smoothens the wafer surface with a combined chemical and mechanical polishing procedure. During production, wafers are coated by a thin layer. To avoid damage to the wafer surface, for instance by stress cracks, the NOx emitted as soon as the wafer is plane and blank must be measured. Therefore, a high-resolution NOx-detector, capable of determining exactly when the polishing process must be stopped, is essential. This approach is used successfully in manufacturing and development lines worldwide, since 1996.

We provide solutions for a wide range of complex problems associated with CMP process control. This has been used successfully in manufacturing and development lines worldwide since 1996. M17 provides a solution for a wide range of complex problems associated with CMP process control. This has been used successfully in manufacturing and development lines worldwide since 1996. The basic approach to control a CMP process containing a nitride change at the stoplayer is the foundation of this M17 system. M17 has been developed jointly by ECO PHYSICS and a leading edge semiconductor company in 1996.