Solutions for the electronics industry - Electronics and Computers
The coating is analysed to ensure its ability to enable electrical contact and its solderability.
Metallic coatings of gold, silver, chromium, copper, nickel, tin, zinc can be applied as either a single layer or multi layers, and in all cases careful control of the layer thickness is required to ensure the coating has been applied evenly and cost-effectively.
XRF analysis is used to improve component reliability assurance through solder alloy composition and coating thickness measurement, also measuring the RoHS (Restriction of Hazardous Substances) elements.
Common application areas for coating thickness for the electronics industry are:
- Analysis of gold and palladium thickness of electrical contacts, for example Au/Ni/Cu
- Measurement of solderability on printed circuit boards such as Ag/Cu/Epoxy
- Through-Hole Thickness Measurement