Inderscience Publishers

Diamond film deposition on M2 steel using TiN interlayers

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The deposition of diamond films to steel substrates is a highly desirable goal that enhances the performance, wear resistance and reduce the coefficient of friction in engineering components and tools. Unfortunately, due to the high temperatures used in Hot Filament Chemical Vapour Deposition (HFCVD), deposition of diamond films to steel substrates is problematic due to the high rate of diffusion of carbon into steel substrates. These effects inhibit nucleation of diamond and subsequent growth to steel substrates. One method of overcoming such problems and improving nucleation and adhesion of diamond films is to deposit a diffusion barrier between the diamond film and steel substrate to prevent carbon from diffusing. Diamond-seeded TiN layers show some promise in becoming an effective method of depositing polycrystalline diamond films to the steel substrates.

Keywords: chemical vapour deposition, CVD, high speed steel, HSS, TiN, diamond film deposition, titanium nitride, steel substrates, polycrystalline diamond films

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