IMEC’s technology choices for process manufacturing steps used for project and process development reflect their commitment to using the best solutions available to them.
Projects are currently underway at IMEC to address major technological challenges for CMOS chips of the 100 and 65 nanometer generation. The center has three full-scale pilot manufacturing lines and
New roadmaps for 300mm wafers and other small devices point to requirements of <1 ppb of dissolved oxygen.
The Use of Liqui-Cel Membrane Contactors at IMEC
Liqui-Cel Membrane Contactors were installed in two locations of the High Purity Water (HPW) loop feeding the pilot lines at IMEC. The contactors have been in operation continuously since September of
The polishing system runs at 35 m3/hr (128gpm). and requires only one 10 x 28 Membrane Contactor for final polishing to < 3.5 ppb of dissolved oxygen. Both systems operate in the the combination mode with 50 torr of vacuum. The total N2 usage is 3m3/hr (1.8 scfm). Because of minimal pressure drop in the Membrane Contactors, repressurization pumps are not required after the degassing step. One of the benefits of Liqui-Cel Membrane Contactors is modularity. They can be placed in two separate locations to better meet the outlet oxygen requirements of the application. By breaking up the degassing system into two parts, the contactors can be located in the final polish step where any oxygen or other gasses picked up in piping or other system components can be removed.