Everest Interscience Inc.

Everest Interscience Inc.

Infrared temperature-measurement products were introduced in the 1980s by Everest Interscience, Inc. These instruments have included many award-winning designs. In the 1990s our President and CEO, Charles E. `Gene` Everest, introduced the first infrared transducers that are completely self-contained and micro-computer-based. In the recent years, Mr. Everest has continued to develop new and innovative instruments with regard to speed of response, accuracy, instrument size and sighting capabilities. These new research projects have revolutionized infrared temperature sensors, providing new instruments for a variety of applications.

Company details

2888 English Rd. , Chino Hills , California 91709 USA
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Business Type:
Industry Type:
Monitoring and Testing
Market Focus:
Internationally (various countries)
Year Founded:

In the 1980s, Everest Interscience introduced infrared temperature-measurement products. Everest Interscience was founded by Charles E.'Gene' Everest.

Mr. Everest possesses more than thirty years of continuous career efforts of designing electro-optical instruments, the last twenty-two years of which have been spent specializing in the design of infrared surface temperature measurement thermometers and sensors.

Subsequent to earning his BSEE from MIT in 1957, he joined Bell and Howell Corporation in Pasasdena, California, designing electro-optical recording oscillographs. After working at the Bell and Howell Corporation in Pasadena and Rockwell International Micro-electronics in Anaheim, California, Mr. Everest become a consultant in his chosen field in 1969. He designed Wahl Corporation's line of infrared thermometers in the early 1970s, including the worlds' first digital handheld infrared thermometer in 1973. In the mid-1970s, he designed Telatemp Corporation's line of infrared thermometers.

His third generation and subsequent generations have been designed for Everest over the last twenty-two years. In that time, he has been a guest lecturer in Australia, China, Canada, Italy, and at various technical meetings and universities in the United States.