TekBox with its two locations in Singapore and Ho Chi Minh City developes and manufactures products for environmental monitoring, agricultural yield application and test equipment for niche applications. We are focused on the SDI-12 bus standard, a solid backbone for low power, digital sensor networks. We also carry out hardware and firmware development services to the quickly growing GPS,GSM and M2M market. Another key focus area of our design activities is LED based automotive lighting. Our services cover the complete product development process – specification, hardware design, firmware design, industrial design, prototyping, field testing and production support. With our in-house assembly capabilities and an established network of partners for industrial design, tooling and volume manufacturing, we can considerably reduce your time to market.
- Business Type:
- Industry Type:
- Environmental Monitoring
- Market Focus:
- Globally (various continents)
This company also provides solutions for other industrial applications.
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We are offering a range of sensors for environmental and agricultural applications. Furthermore we offer a comprehensive range of converters to integrate conventional sensors into SDI-12 sensor networks. We are continuously working on expanding our sensor and converter portfolio.
Hardware and Firmware Development Services
Our team of design engineers carries out complete electronic product design projects. Sound know how in the fields of analog and digital hardware development, mechanical design, embedded firmware design, experience with type approval and NPI support and the awareness of customer requirements is one of the corner stones of our set up. A wide range of laboratory equipment plus our in house assembly facility is key to quality and fast time to market.
Accurate, state of the art pick and placement machines enable us to build all our prototypes and products in house. Our manufacturing team masters the assembly of virtually all types of packages from through hole components to SMD components as small as 0201 and 400µ pitch BGA/CSP and COB.