environmental footprint reduction Articles
1 articles found
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Life cycle assessment of integrated circuit packaging technologies.
Background, aim and scope Nanostructured polymer particles are produced to be used in ball grid array (BGA) and chip scale packaging (CSP). The technology could replace conventional BGA and CSP metal balls, and the hypothesis is that the shift could be eco-efficient as polymer core particles increase the reliability. For the first time, these particles are environmentally evaluated.Materials and ...
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