A new solution for microscopic measurement of 3D shape, deformation and strain is now available from Dantec Dynamics.
New µDIC solution for microscopic measurements.
The all-in-one measurement system is based on digital image correlation (DIC) – an optical solution with no contact to the measurement sample. The solution is a must-have for industries dealing with subjects like warpage measurement and thermal expansion.
The micro-electronics industry who is challenged by increasing miniaturization of component and high-density package design can benefit from this solution. Real-time image correlation of shape, deformation and strain can provide easy and fast warpage measurement, CTE determination or FEM validation.
The µDIC system for microscopic measurement of 3D shape, deformation and strain.
The solution comes as a complete system with stereo microscope, illumination, heating/cooling stage, 5 megapixel cameras and user friendly measurement software. The system provides easy and fast full-field, 3D deformation and strain analysis. The results include complete shape, deformation and strain data, temporal and spatial plots, data of virtual strain gauges, STL data for CAD processing as well as images and movies for presentation purposes.
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