AEON Series - Model MSPXXXSC-36 - Multicrystalline
Laser Cut Technology: By reducing the area of each wafer before cell production, with precision revolutionizing laser-cut processing, then connecting cells in a parallel formation, the amount of electrical current carried by each busbar is reduced by 20%. This results in the decrease of electrical resistance within the busbars and an increase in overall efficiency of up to 2.5%.
Through an industry-leading innovation of integrating 3 busbars into each cell, internal electrical resistance is reduced, boosting cell output up to 3%*. This is possible because the distances between the busbars are shorter and less current flows through each smaller electrode where resistance is the highest.
*Approximate improvement compared to a standard 2 busbar cell.