Plasma Reflow System
From Essembly Equipment
Features: Reduces oxides in the solder by irradiating hydrogen radicals having strong reducing power generated in H2 plasma when heating and melting solder bumps in order to enable formation of pure bumps.
- Solder bumps are melted in vacuum so that the foams (void) in the bumps can be eliminated.
- The heater stage is provided with a quenching mechanism, which shortens the reflow time and enables post-reflow quenching so that excellent reflow conditions are attained.
- Equipment is automated so that 6 or 8-inch wafers can be processed in a cassette-to-cassette manner.