SonoFlux - Model 2000F - Stationary Ultrasonic Spray Fluxing System
From Equipment Solutions
Stationary ultrasonic spray fluxing system for low mix/dedicated lines with medium to high volume. No moving parts mean ultra-low maintenance and the highest reliability and is compatible in all major wave solder machines. All SonoFlux systems feature non-clogging, repeatable, low maintenance ultrasonic spray performance with up to 80% reduction in flux consumption.
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Basic Specifications
- SPRAY ASSEMBLY DIMENSIONS:
- 330mm (13”) configuration – 514.4mm W X 330.3mm L x 193.5mm H (20.25” W x 13” L x 7.62” H) or 610mm (24”) configuration – 514.4mm W X 610mm L x 193.5mm H (20.25” W x 24” L x 7.62” H)
- PCB WIDTH RANGE: 50-330mm (2–13”) or 50-610mm (2-24”)
- CONTROL: Backlit LCD PLC with menu-driven 17-key keypad and wheel encoder
- FLUX DELIVERY: High precision gear pump
- POWER REQUIREMENTS:
- 110/120 VAC, 50/60 Hz or 220/240 VAC, 50/60 Hz
- Single phase, 750 VA max
- AIR: 483-1034 kPa (70-150 PSI) @ 85 LPM (3 CFM)
- CERTIFICATION: CE
- ULTRASONIC NOZZLE DESIGNS: High transfer dual jet design
Features
- Only a monthly clean up, even with rosin flux
- High velocity flux transfer for maximum top-side fill
- Uniform coverage
- Reduction in flux consumption up to 80%
- Non-clogging ultrasonic design
- Elimination of thinner
- Easy operation and maintenance
- Compatibility with all fluxes
- Deposition density control micrograms/inch
- Single or dual nozzle configurations available
The 2000F is designed with a high transfer efficiency spray assembly and a closed spray chamber, to capture any rosin flux vapor in the environment.The system can either be installed internally in your wave solder machine, or can be available as a stand-alone unit, both with a variety of optional features.
Low maintenance and no operator intervention, are ...
Low maintenance and no operator intervention, are the primary features of the SonoFlux 2000F. Only a monthly cleaning is necessary (even with sticky rosin flux).
The system is also equipped with a high velocity flux transfer system, to help with PCBs that have difficulty with topside fill, such as those with thick back planes, tight lead-to-hole ratios, or contaminated components.
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