Bonding Services
MicroElectro mechanical devices are often made from a plastic/glass/silicon/silicone layer covered by additional layers. The sealing strength between the layers could be critical to the performance of the device.
-
Most popular related searches
Service Details
Although the bonding approaches used in micro fabrication foundries are powerful, they might not be appropriate for the larger volume production of your device for various reasons. This could pose a bottleneck to the production of your micro device.
We select appropriate scalable processes for bonding which best fit your device’s important surface requirements such as contact angle, chemical/solvent or biological contaminants, inhibitory agents, roughness, or optical/fluorescence issues.
Videos related to this service
-
About uFluidix Video
uFluidix specializes in silicone (PDMS) and thermoplastic (PMMA, PC, PS, COC, and COP) microfluidic chips and devices for microtechnology applications.
Customer reviews
No reviews were found for Bonding Services. Be the first to review!