Sealless Magnetic Drive Pumps for PCB Industry - Electronics and Computers

Types of PCB Process:

The PCB process is basically divided into dry process and wet process.

Dry Process:Cutting → Press film → Exposure → Press → Drilling → Routing

Wet Process:Brushing → Inner Layer Imaging → Inner Layer Etching → Inner Layer Stripping → Oxide Treatment → PTD → Immersion Copper → Outer Layer Imaging → Copper Plating → Tin plating → Outer Layer Stripping → Outer Layer Etching → Stripping → Solder Mask → Legend Printing → Surface Finish

Next, several important stages of the wet process will be described as follows.

1. Brushing
   The brushing process at the beginning requires multiple washings to achieve the purpose of cleaning. Rinse: Wash off the dust on the copper surface to ensure the surface is clean and dust-free.
   Acid cleaning: Clean the copper surface with chemical solution to increase the roughness and facilitate the subsequent adhesion of nickel alloy to the copper surface.
2. Developing
   Use the developing solution to dissolve and rinse the non-photosensitive dry film. The photosensitive dry film is hardened by the photosensitive, so the developing solution cannot be dissolved, and it will be retained and attached to the board surface to form a circuit pattern.
3. Etching
   First, wash away the non-photosensitive outer dry film with chemical water, and the copper surface not covered by tin below (that is, the unnecessary copper surface) will be exposed, and then etch with an etching solution to dissolve away the unnecessary copper surface, only the copper surface on which the dry film is attached will be left to form the wiring areas.
4. Plated Through Hole(PTH)
   Each layer of circuits is connected by vias, which means that different circuit layers are connected by drilling holes. However, it is not possible to conduct electricity simply after drilling, and copper must be plated on the surface of the through holes for conductivity to allow these circuit layers to be electrically connected.
5. Immersion Tin
   A thin layer of tin is deposited on the copper surface of the PCB to protect the copper surface from oxidation before etching.
6. Stripping
   Wash away the tin on the surface with a tin-lead stripper, leaving the required circuit pattern.
7. Surface Finish
   Finally, surface finish is carried out on the exposed copper surface not covered by the solder mask layer to avoid oxidation of the bottom copper surface, so as to ensure good solderability or electrical continuity during PCB assembly.
   There are two main types of surface finishes: metallic and organic. HASL, immersion gold and immersion tin all belong to metal surface molding, while OSP belongs to organic surface molding.

After the circuit board is manufactured, how to properly dispose of the waste liquid at the end of the process and effectively prevent pollution problems, building a complete recovery and discharge system is very important, so that safety and environmental protection can be considered.

PTCXPUMP Sealless Magnetic Drive Pump can be safely applied to:

• Chemical Supply System
• PCB Process: brushing, developing, etching, stripping, surface finish, etc.
• Wastewater treatment System

PTCXPUMP sealless magnetic drive pump is used in the PCB industry to provide you with the best solution to transfer fluid. The design without mechanical seal can effectively avoid leakage, and the material is GFR-PP and CFR-ETFE, which has excellent corrosion resistance and is suitable for transporting highly corrosive liquid such as hydrochloric acid, sulfuric acid, hydrofluoric acid and acetic acid or flammable and explosive fluids. In the PTCXPUMP sealless magnetic drive pump series, PTC-100 ~ PTC-251 are for small applications, and PTC-400 ~ PTC-675 are for medium and large applications. There are various models to meet your various operating needs. PTCXPUMP is committed to becoming your preferred choice for resting assured to use pumps.