- Home
- Companies
- UDM Systems, LLC
- Applications
- Wafer dicing & surface cleaning ...
Wafer dicing & surface cleaning solutions for semiconductor sector - Energy
Which Semiconductor product is right for you? At UDM Systems®, all of our products are eco-friendly and we pride ourselves on being completely biodegradable, non-corrosive and non-hazardous. UDM offers many solutions to suit your wafer dicing/singulation needs.
Wafer following circuit formation process
Wafer enters back-end processes after circuit/chip formation.
Wafer mounting
Dicing tape is applied to rear of wafer to hold wafer in place on film frame.
Wafer dicing (wafer cutting)
Chips or die are separated during wafer dicing process.
UDM PRODUCTS USED:
Rinse/clean and dry wafer
Wafer is spin rinsed with deionized water and spin dry.
Wafer inspection (analyzing for defects)
Wafer is inspected manually or automated to identify any defective die.
Pick and place / sorting process
The individual chips or die are picked from the tape and packaged.
Both LDS and AD model dispensers are specifically engineered to work with all UDM Systems® L-Series Products. By using our L-Series products with our dispensers to precisely inject the proper amount of additive to the deionized (DI) water reduces water surface tension and allows cooling water to penetrate down in the Kerf. Heat transfer optimization, extended blade life, electrostatic discharge reduction and improved wafer and die reliability are what you can expect from our products.