Aragon Photonics Labs. S.L.U.
3 products found

Aragon Photonics Labs. S.L.U. products

Fiber Optic Sensing

High-Fidelity Distributed Acoustic Sensor

HDAS is a High-Fidelity Distributed Acoustic Sensor that detects vibrations in tens of kilometers. With its proprietary linear measurement technology, it provides unmatched signal quality across all measured fiber length and magnitude measurement capabilities. The HDAS box is conceived as a scientific instrument, with comprehensive tools to measure, record and analyze the signals present in the fiber. Furthermore it can also be used as a platform for application development, allowing third party data processing directly on the main processing unit.

Brillouin Loop Analyzer of Strain and Temperature

BLAST is a Distributed Temperature Sensing (DTS), that allows for the precise measurement of temperature and strain values along a conventional fibre, is one of the most common DFOS techniques, with a wide range of uses and already stablished applications in different environments. Different methods and technologies can be employed to obtain DTS measurements. Aragon Photonics presents a Brillouin Optical Time Domain Analyser (BOTDA) technology based DTSS capable of reliable and precise temperature measurements along a conventional fiber. Presented in a simple to use and highly configurable interrogator that can provide to both scientific and industrial groups an invaluable tool to develop new research and applications.

 
 

T&M Optical Communications

HDCA - High Definition Component Analyzer

The new High Definition Component Analyzer (HDCA) from Aragon Photonics lands to characterize passive optical devices with the highest resolution and wavelength accuracy, the fastest measurement time and largest dynamic range. The spectra profile of insertion losses (IL), return losses (RL) and polarization dependent losses (PDL) of passive optical devices can be measured with femtometric resolution and fully automated. HDCA is the ideal tool for manufacturers and developers of next generation passive components, including ring resonators, arrayed waveguide grating (AWG), quantum chips, wavelength selective switches (WSS), fiber Bragg gratings (FBG), photonic integrated circuits (PIC), or any Ultra-DWDM network components.