CAPLINQ Europe BV products

Coatings, powders & Resins - Epoxy Binding Resins

Model DK14-2100 - Brown Binding Resin

DK14-2100 was designed for the purpose of meeting both the binding resin, and coating powder requirements while also achieving the higher thermal class requirements. Due to the epoxy powder it has excellent green strength that holds the powdered metal together post pressing but pre curing. DK14-2100 is a low shrinkage binding resin that reduces core stress to minimize the effect on magnetic and inductance properties. At the same time its low moisture absorption allows it to maintain superior physical and magnetic properties when exposed to humidity. This "best of both worlds" product also has a higher Tg allowing it to meet the thermal class rating of a Class F powder at 155°C and display no degradation in color or physical properties.

Die Attach Materials - Die Attach Films

Model CDF 200 - Loctite Ablestik

LOCTITE ABLESTIK CDF 200 highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. It can be used in a variety of die sizes ranging from 0.2mm x 0.2mm to 5mm x 5mm . This adhesive exhibits strong adhesion to various wafer metallizations and leadframe finishes. LOCTITE ABLESTIK CDF 200 offers high MSL reliability, controlled fillet size and does not exhibit resin bleed out. It has good wetting and low warpage on multiple die sizes and is recommended for thin wafer handling applications. It comes in 15 and 30um and is typically used for QFN, SOIC and SO package applications.