Chiral Photonics, Inc. products
Multicore Fiber Fanout
Multicore fiber (MCF) is increasingly of interest for applications ranging from 3D shape sensing to space division multiplexing to high density coupling for photonic integrated circuits and interconnects. Due to the tight channel spacing in multicore fiber, addressing each core individually is challenging. Chiral’s Multicore Fiber Fanout (MCFFO) enables addressing individual cores of these fibers with high precision and low loss. Fanouts are typically shipped in spliced pairs. This configuration enables full testing of insertion loss and crosstalk for each pair. MCF and pigtail lengths can be tailored to your needs. The fanout pigtails, the 7 fibers shown in the example above, are typically standard singlemode fibers. However, we have fabricated many custom fanouts with pigtail fibers tailored to meet specific customer needs. Fanouts can be fabricated to include connectorization and assembly with other components, as desired.
Pitch Reducing Optical Fiber Array – One-Dimensional (1D)
Unlike typical fiber arrays, PROFAs provide high density coupling that, for example, minimizes the valuable chip real estate needed for optical input/output (I/O) for fiber-to-chip applications. PROFAs can provide spot size conversion between small cross-section, chip-based waveguides and standard optical fibers, for example. PROFAs can also maintain, or even increase, mode field sizes, independent of changing channel-to-channel spacing, as might be critical for high power applications. PROFA1Ds are available as single-channel device or as linear arrays up to six channels. PROFA1Ds are typically used for chip edge coupling to waveguides, for example, with approximately 2 μm diameter mode field sizes.
Pitch Reducing Optical Fiber Array – Two-Dimensional (2D)
Pitch Reducing Optical Fiber Arrays (PROFAs) provide low loss coupling between standard optical fibers and photonic integrated circuits. Unlike typical fiber arrays, they also provide high density coupling that minimizes the valuable chip real estate needed for optical input/output (I/O). They can provide spot size conversion between small cross-section, chip-based waveguides and standard optical fibers. Two-dimensional (2D) PROFAs are used for chip surface coupling to vertical grating couplers with mode field diameters of approximately 6 or 10 µm or to chip-based devices such as VCSELs or photodiodes. Standard 2D PROFAs are available as hexagonal lattice arrays with up to 61 channels. One-dimensional (1D) PROFAs (see separate PROFA1D datasheet) are available in standard linear arrays of one to six channels and are typically used for chip edge coupling to waveguides with approximately 2 µm diameter mode field sizes.
Coupling and Packaging
In addition to supplying enabling optical I/O (input/output) components (PROFA1D, PROFA2D) to you or your preferred packaging vendor for wafer-level probing, coupling or packaging, Chiral Photonics also offers optoelectronic packaging services. We offer coupling and packaging services that can include both electrical and optical I/O. Send us your diced chips and we will return packaged and connectorized devices with fast turnaround. Alternately, we can help you develop a process and work with you to transfer it fully to you. We aim to work with our customers in the best way suited to their needs.
Polarizer
The Helica™ In-Fiber Polarizer (IFP) is an all-glass, flexible polarizer for users requiring the best polarization extinction ratio (PER) available over a broad spectral range within a fiber. The polarized light is scattered over the length of the chiral grating rather than absorbed. Polarizers have been delivered to address specific spectral needs ranging from 800-2000 nm. Specifications and typical spectra for polarizers with central wavelengths at 1550 and 1310 are shown below. Custom pigtails, jacketing, cabling and connectorization can be accommodated. Please speak to us about your specific needs.
