Cicor Management AG services

Cicor has many years of experience in testing and developing product-specific tests and test systems, from in-circuit testing to complex functional test systems. Optimally, testing engineering is already integrated during the development phase, so that requirements for the subsequent test execution can be covered during product design.

Cicor develops innovative electronics and associated software for customers in the fields of medical technology and industry. Cicor supports you from the idea to the finished product. The development process is ISO9001 and ISO13485 certified and Cicor also meets the requirements for the development and production of accessories for mobile devices from a leading manufacturer.

At Cicor`s manufacturing sites, engineers are permanently working on processes, to provide our customers with products that are compliant with the highest quality standards at a competitive cost level.

At Cicor, we specialise in providing top-tier Printed Circuit Board Assembly (PCBA) services tailored to meet the needs of diverse industries. Our expertise in Surface Mount Technology (SMT) and Through-Hole Technology (THT) ensures reliable and efficient assembly of printed circuit boards.

The Cicor Group offers an extensive portfolio of packaging and interconnection technology for the manufacturing of microelectronic modules and assemblies. Several production lines are available for fully automatic and semi-automated processes.

The Cicor Group`s manufacturing facilities are well equipped with advanced tool room machinery, along with proven track records, systems and highly trained staff; Cicor manufactures high precision molds that meet the highest quality standards and will provide trouble-free, high-volume production for the life of the product. Cicor specializes in steel molding.

Thin-film technology uses semiconductor and microsystem technology processes to produce circuits on ceramic or organic materials. The metal deposition method uses vacuum processes and the flexibility that can be achieved in terms of thickness and type of metallization in particular, set thin-film technology apart from printed circuit board technology. Interconnection carriers (substrates) in thin-film technology enable extreme connection densities, high-precision geometries of conductors and insulator materials and high thermal conductivity, while offering maximum reliability.