Denton Vacuum, LLC products

The Infinity FA System is a cost-effective solution for etching and profiling devices with high throughput, providing rapid results at a low cost of ownership. It delivers excellent delayering uniformity and minimal damage over large areas. The fully integrated SIMS package provides the precision required to locate small defects for further analysis. By using multiple etch technologies, the etch rates of different components of a single layer can be matched, enabling uniform removal of the entire layer regardless of chemical composition. Backed by Denton’s commitment to partnership, the Infinity FA tool delivers quality performance and high system uptime. Our global service team will provide you with a trusted preventive maintenance schedule and responsive support to ensure the best productivity and production results.

The Infinity IBD System delivers dense, lower defects films with extremely high precision and uniformity. It offers independent control over ion energies, so you can achieve exacting thin film specs with very low contamination from flaking. The Bias Target Sputter module offers excellent control of thin film interfaces, provides independent control over ion currents and energies, and operates at a low pressure. This eliminates contamination and scatter from beam overspill, prevents surface damage, enables tight stress control, and creates dense, defect-free films. The BTS module improves cost of ownership with increased target usage that allows you to reduce the overall target size. The system design makes it possible to achieve excellent uniformity on large substrates without rotation. The module offers pulsed sputtering and a higher deposition rate compared to other IBD platforms.

The production-proven Discovery platform can handle substrates up to 300mm. The cluster configuration makes it suitable for multi-layer, oxygen-sensitive applications and high throughput requirements. The platform accommodates DC, pulsed DC, and RF sputtering, which feature the single-cathode configuration for high uniformity, as well as confocal co-sputtering capability. Denton’s proprietary PEM technology enables high rate reactive sputtering of metal oxides and nitrides. Ion assisted deposition is also available. With independent electro-pneumatic source shutters and chimney assemblies, you can prevent cross-contamination of your source material. Multiple pump configurations, including cryogenic and turbo, as well as pump placement options provide the design flexibility we need to meet your process and productivity requirements.