E+H Metrology GmbH products

Total Modular Concept Maximum flexibility on integration of required components.Short production time.High lifespan. Low Maintenance.Robust design due to reusability of proved and tested components. More than 15 years experience with robot sorters.

We customize your MX 202 perfectly fitting to your demands (e.g. metrology, sender/receiver stations).Speed, Speed and Speed. Sort with up to 1000 Wafers per hour.

The quality of a capacitive sensor system can be rated by the sensors range, accuracy and precision in relation to the required size of the active sensor surface. The E+H capative technology is now developed for more than 40 years.E+Hs seamless construction of the entire sensor system, starting at the sensor, own special cables (constructed by E+H) and the sophisticated electronic lead to a unique world class sensor system.

The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds. Before starting to scan the wafer, the gauge recalibrates itself automatically by means of a standard thickness gauge block. A pair of capacitive sensors samples four radial profiles (45 degrees) on every wafer.

Up to four thickness measuring range user selectable. Dynamic range 100 or 350µm. Wafer diameter 4", 5" and 6". Accuracy 0.1µm. Resolution 10nm. Spartial resolution 1mm. 4 scans. Software MXNT.

The MX base series are manual tools, where some of them can also be used as modules on E+H automatic robot tools or as OEM tools.Please note that all technical tool specifications can be modified to your wishes in accordance with the physical limits of the tool.High Resolution Wafer Tool Up to four thickness measuring range user selectable. Dynamic range 100 or 350µm. Wafer diameter 6` and 8`. Accuracy 0.1µm. Resolution 10nm. Spartial resolution 1mm. 4 scans. Software MXNT.

The MX base series are manual tools, where some of them can also be used as modules on E+H automatic robot tools or as OEM tools.Please note that all technical tool specifications can be modified to your wishes in accordance with the physical limits of the tool. High Resolution Wafer Tool Up to four thickness measuring range user selectable. Dynamic range 100 or 350µm.Wafer diameter 8` and 12`. Accuracy 0.1µm. . Resolution 10nm. . Spartial resolution 1mm. . Up to 8 scans. . Software MXNT.

The MX base series are manual tools, where some of them can also be used as modules on E+H automatic robot tools or as OEM tools.Please note that all technical tool specifications can be modified to your wishes in accordance with the physical limits of the tool. High Resolution Wafer Tools Up to four thickness measuring range user selectable. . Dynamic range 100 or 350µm. Wafer diameter 300 and 450mm.Accuracy 0.1µm. . Resolution 10nm. Spartial resolution 1mm. . up to 8 scans.Software MXNT.