EBARA Precision Machinery Europe GmbH (EPME) products

Air-cooled EV-A dry vacuum pump for excellent performance at atmospheric pressure. The EV-A is ideally suited as an air-cooled dry pump for a non-reactive, general vacuum. The EV-A is the perfect solution, particularly for lithium-ion battery production. A model with bearing flushing is optionally available. The EV-A models comply with CE standards.

The EV-S has the lowest power consumption in its class. The flexible rotation speed and idle mode make their contribution to save energy. In clean applications no N2 purge or nitrogen is required.

The EV-M with its multi-stage lobe design is best used for harsh duty applications. It has a higher H2 pumping speed compared to screw type vacuum pumps. The idle mode provides additional energy savings. The EV-M is powerful with low energy demands. Water-cooled EV-M for harsh processes and reduced emissions.

Water-cooled dry vacuum pump ESR with superior corrosion resistance. The ESR is perfect for medium to harsh applications with low ultimate pressure. The variable pumping speeds ensure a highly flexible usage. Low noise level and low vibration are key features of the ESR series.

The EST qualifies for harsh applications generating reactive chemical by-products. It manages large gas loads and enhanced powdery by-products. The compact design allows for increased operating temperatures and corrosion resistant material. Water-cooled EST dry vacuum pump for powdery, corrosive applications.

The EMT is a 5-axis magnetically levitated, hydrocarbon-free vacuum pump. Five major EMT types are available providing temperature control, corrosion resistance, ultra-low vibration and much more. For ultra-high vacuum requirements and the harshest applications.

The EBT is a ceramic bearing turbo vacuum pump for high-tech manufacturers. The rugged mechanical bearing design is cost-effective and covers all relevant safety standards. Available with water, fan or conventional cooling. For clean, reliable and vibration-free vacuum.

The F-REX200M2 polishes 200 mm wafers with high k-materials and aluminium layers. Equipped with user-oriented system configuration, the modular design is suitable for multiple process setups. Also available for 150 mm wafers is the F-REX150M2.

Semi and fully automated systems – the UFP300A or UFP300AD. The wafer plating systems enable fast, high performance processing for depositing fine conductive patterns on wafers. This includes bumps, pillars, re-wirings and through silicon via structures, which are essential for packaging techniques.