Epoxy Technology, Inc. products

Category : Electrical. Conductivity : Electrical. Cure Type : Oven. Number of Components : 2. Pot Life Value : 24 hrs. Viscosity Value : 500-1,000cPs @ 100 rpm. Tg Value : ≥95°C. Thixo Value : N/A. Recommended Cure : 150°C/1 hr. Die Shear Strength : ≥10 kg. Thermal Conductivity : 0.44 W/mK. CTE : 56 x 10-6 in/in/°C (below Tg). Index Of Refrection : N/A. Spectral Trans : 0.1% @ 400-1500 nm. Hardness : 80D. Packaging Options : N/A. Market : Electronics Assembly, Hybrid, Optical, Semiconductor Application : Circuit / Electronic Assembly, Electrically Conductive, Hybrids Microelectronics, Semiconductor Back.

A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized. Higher viscosity version of EPO-TEK 430.

A single component, thermally and electrically conductive, epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a pot-life of several days, low temperature cure and syringe dispensing rheology. It can be used for electrical connections when bonding chips, S2v£Ds: PCBs and substrates.