Hitachi High-Tech Analytical Science products

Coatings Analyzers

Hitachi High-Tech - Model X-Strata920 - Coating Thickness Measurement and Materials Analysis

Coating thickness measurement based on X-ray fluorescence (XRF) is an industry-proven technique, offering fast and non-destructive analysis. The X-Strata920 is designed to measure singlelayer and multi-layer coatings including alloyed layers for both the electronics and metal finishing industries. Our in-house applications experts have optimised the X-Strata920 to ensure you get reliable, repeatable results for hundreds of applications including PCB surface finishes, connector coatings, corrosion resistance, decorative finishes, wear resistance, high temperature resistance and more. Where every mil or micron counts, the X-Strata920 gives you the precision and reliable results you need.

Hitachi High-Tech - Model FT110A - Microspot XRF Analysers

The FT110A - Measure the miniscule; The FT110A helps a broad range of industries ensure plating specifications are met to avoid the risks of inferior performance and the costs associated with scrap or rework. In addition, it helps increase productivity by reducing the time needed to set up a series of measurements. Accuracy and reliability are crucial in any Quality Assurance or Quality Control system, and the improved X-ray fluorescence technology inside the FT110A will support your facility in meeting the highest industry specifications. The updated imaging system, new automatic measurement positioning functionality and a large sample table makes this benchtop coatings analyser easy to use, increasing sample throughput. The unit is controlled via an intuitive user interface on the Windows-based X-ray Station software. This helps to streamline your QA/QC setup through direct integration of data into Microsoft™ Word and Excel.

Hitachi High-Tech - Model FT230 - Rapid Coatings XRF Analysis

Every element of the FT230 is designed to reduce the time it takes to complete an XRF measurement so that you can act on your results faster, reducing waste and increasing throughput. At a fundamental level, we’ve made it easier and simpler to interact with the instrument. All you need to do is load your part and run the Find My Part™ routine and the FT230 will find the features that need to be measured, choose the correct analysis program and send the results where you need them. Operators have fewer decisions to make and can spend more time performing other tasks. There’s no need for your XRF to be the bottleneck in your production. From minute electronics components to large-scale plated parts, the FT230 helps you get more done in less time, making it easier to achieve 100% inspection.