Indium Corp. products
Model For Medical Devices and Electronics - Paste
Spherical, low-oxide powder available in various mesh sizes, Pb-free, Pb-containing, AuSn and indium-containing alloys, No-clean, water or solvent cleanable flux vehicles, Flexible packaging and quantities to support manufacturing requirements.
Engineered Solder Preforms
Precise chemistries and physical properties, Precise dimensions and volume, Lab-tested and field-proven, Reliable performance and excellent technical service.
Model 8.9 - Pb-Free Solder Paste
Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, and other alloy systems favored by the electronics industry to replace conventional Pb- bearing solders. Indium8.9 offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of Indium8.9 minimizes false failures in ICT.
Fusible Alloys
Several very low melting point Indalloy® alloys are liquid at room temperature. These alloys are finding increased uses in various applications formerly reserved for mercury metal. This is due to the fact that the metals in these alloys have lower toxicity than mercury, and, perhaps more significantly, that the vapor pressures of these alloys are substantially lower than mercury.Alloy systems liquid at room temperature have a high degree of thermal conductivity far superior to ordinary non-metallic liquids. This results in the use of these materials for specific heat conducting applications, i.e. for heat dissipation of sensitive components during operation, machining and/or manufacturing.Wire
Indium wire from Indium Corporation is manufactured to demanding quality standards. Our flexible manufacturing process allows us to fulfill orders from evaluation/research quantities to full-scale production volumes. Capabilities range from .001" (0.025mm) diameter to .250" (6.35mm) and larger. Actual dimensions achievable are subject to the properties of each metal.
InFORMS - Achieving Uniform Solder Bondline Thickness
InFORMS are reinforced solder preforms that help maintain the required bondline and promote good solder wetting. During the soldering process, the copper does not melt, ensuring that the bondline is maintained across the entire solder joint. This results in: Improved mechanical and thermal reliability; Uniform bondline thickness; Low-voiding performance.
Indium - Model Durafuse LT - Low-Temperature Alloy System
Durafuse LT is a low-temperature alloy system designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210°C. Durafuse LT provides improved drop shock resilience, outclassing bismuth-tin (BiSn) or bismuth-tin-silver (BiSnAg) alloys, and performing better than SAC305 with optimum process setup. Durafuse LT is made up of a low-melting indium-containing alloy and a higher-melting SAC alloy. The SnInAg alloy initiates joint fusion while the SAC alloy provides enhanced strength and durability. Durafuse LT is ideal for high-reliability applications, which utilize thermally sensitive components.