InnoLas Systems GmbH products

The DIMENSO is a laser processing system designed for high-precision and high speed applications in the photovoltaic and glass industry. The gantry system is designed for selective ablation of thin film layers on big size glass, with the ability to remove layers from the top or through the glass from the bottom side. The system is available with mechanical scribe heads (from top) or with multiple laser beam heads (from top or bottom). System speed is up to 2000 mm/ sec.

The DIVIDOS with superior ablating technology, set’s the new standard for depaneling of printed circuit board systems.

The EXPEGO is a laser processing workstation designed for high-precision applications in the electronic, precision engineering, and photovoltaic industries. It is mainly used for microvia drilling, cutting (routing), structuring and cavity formation in PCBs with typical dimensions as 610 x 460 mm and 635 x 540 mm.

The LINEXO is a versatile laser processing workstation designed for high-precision applications in the electronic, precision engineering, and photovoltaic industries. It is often used in R&D environments, as well as production of smaller substrates as e.g. ceramic PCBs.

The ULTAGO  is a powerful laser processing workstation designed for high-precision applications in the photovoltaic industry. It achieves throughput of 6000 wafers per hour for solar cells and is used in high-volume production environments. Different from linear table machines, in the turntable machine loading, unloading, alignment, as well as laser processing are carried out in parallel in order to reach optimum productivity.

Laser doped selective emitters (LDSE) reduce the contact resistance through selective overdoping of the contact areas. The InnoLas process solution achieves highest alignment accuracies down to 10 µm, an extremely homogenous energy ditribution through mask imaging with beam sizes from 100 - 300 µm.