Jiangsu Chenda Electronic Co., Ltd. products

The plastic package carries Underwriters Laboratory. Flammability Classification 94V-0. For surface mounted applications. Low reverse leakage. Built-in strain relief, ideal for automated placement. High forward surge current capability. High temperature soldering guaranteed: 250 C/10 seconds at terminals.

Low profile space. Ideal for automated placement. Glass passivated chip junctions. Low forward voltage drop. Low leakage current. High forward surge capability. High temperature soldering：. 260℃/10 seconds at terminals. Component in accordance to. RoHS 2002/95/1 and WEEE 2002/96/EC.

Glass passivated device. Ideal for surface mouted applications. Low reverse leakage. Metallurgically bonded construction. High temperature soldering guaranteed: 250 C/10 seconds,0.375”(9.5mm) lead length, 5 lbs. (2.3kg) tension.

Glass passivated device. Ideal for surface mouted applications. Low reverse leakage. Metallurgical bonded construction. High temperature soldering guaranteed: 250°C/10 seconds,0.375"(9.5mm) lead length, 5 lbs. (2.3kg) tension.

The plastic package carries Underwriters Laboratory Flammability Classification 94V-0. Construction utilizes void-free molded plastic technique. Low reverse leakage. High forward surge current capability. High temperature soldering guaranteed: 250 C/10 seconds,0.375”(9.5mm) lead length, 5 lbs. (2.3kg) tension.