LG Chem, Ltd. products

Advanced Materials

Backside Grinding Tape

Material which protects the wafer surface during back grinding. BGT(Backside Grinding Tape) is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties.

Back Plate

Adhesive film as a reinforcement plate attached on the rear surface of the plastic OLED panel. Back Plate is an adhesive film attached on the rear surface of a POLED(Plastic OLED) panel to play the role of a reinforcement plate. It prevents curling, which is a phenomenon in which the panel is wound.