Machine Vision Products, INC. products

MVP’s new Cross Platform, High Performance 3D AOI Solution; Building on MVP’s near 30 years experience of innovative Automated Optical Inspection the Versa system brings the latest 3D technologies to MVPs SMT and SPI offerings and is a significant advance in the flexibility of PCB assembly inspection.

MVP’s new Cross Platform, High Performance 3D SPI Solution; The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.

The MVP Selecta II AOI is designed to complement both wavesolder and selective solder processes. Utilizing look up optics the Selecta II inspects the components soldered by your bottom-side soldering solution. MVP’s Selecta II allows for full bottom-side inspection of all wave solder joints including PTH and SMT components in glue. The Selecta II can be used to ensure the quality in your second side process and comes with ease-of-use programming software.

The Spectra Series II Quad-Color Technology system is the largest format AOI solution for large board sizes, backplane and EV battery inspection. The Spectra is flexible to inspect boards up to 35” x 35” on the standard Spectra platform and the Spectra XL option expands the capabilities to 35 x 40”; The Spectra is configured with robust material handling to allow the inspection of the heaviest of products. In addition the Spectra can be configured to use MVP’s confocal technology to allow the inspection of press fit connectors to determine the correct pin height within the barrel.

The MVP 900 is available in two configurations for Wafer Inspection. The ALW supports full automation integrated with a single arm robot and a pre-aligner. Wafer sizes are supported from 100 through 300mm. The 900 W is a low cost manual load configuration with same side load/unload.