Okamoto Corporation products

Fully Automatic wafer grinder with down-feed grinding method and Robotics wafer handling.

Model SPP600S is designed to polish semiconductor materials such as silicon, carbide, ceramics, brittle materials and metal. Stable uniformity and edge shape is achieved by our unique polish head design, and temperature control system. Pad surface, pad bulk condition, and pad surface temperature detecto r system are available as options.

Fully Automatic slicer for cutting brittle electronic material up to 100mm diameter.

Fully automated multi-step process sequence providing rough and fine grinding. One clamp centering system ensures proper centering for precision parallel side stock removal grinding. R Chamfering and C Chamfering.