PCB Technologies Ltd products

PCB Technologies and its PCB Assembly division (AMS Electronics) provide high-mix high-technology electronic assembly solutions. Our processes and procedures are designed to provide maximum flexibility and quick response to your changing needs. With a highly experienced technological team we can support the most complex assembly technologies, including: 01005 placement, POP Placements, multi layers boards, complex BGA’s/QFN and more.

At PCB Technologies, we are uniquely equipped to tackle the toughest challenges in UAV electronics. From thermal management and EMI compliance to high-speed processing and miniaturization, our advanced IC packaging and turnkey solutions are engineered for peak performance. With decades of expertise in defense and aerospace, we provide UAV designers, manufacturers, and engineers with cutting-edge PCBs, including specialized solutions for drone PCBs and counter UAV systems. PCB Technologies solutions are crafted with  stringent and advanced processes to ensure reliability in extreme environments, seamless multi-sensor integration, and unmatched operational efficiency.

Advanced Packaging is a blanket term used to describe a general grouping of various distinct methodologies. Advanced Packaging technologies include: 2.5D, 3D, Fan-Out (2D), Wafer Level Packaging and System-in-Package (SiP). SiP is a combination of multiple active electronic components of diverse functionality, assembled in a single unit, that performs multiple functions associated with a system or sub-system.