Plasma Ruggedized Solutions
5 products found

Plasma Ruggedized Solutions products

Engineering, Design & Prototyping Services

Plasma Ruggedized Solutions - EMI / RFI Encapsulation Services

Protecting Your Electronics with Conformal Coating and Potting

At Plasma Ruggedized Solutions (PRS) specializes in EMI/RFI shield engineering, design and prototyping. Our advanced processes gaurantee the effectiveness of your potting and encapsulation solutions. Our experienced team leverages CAD/CAM, 3D printing and CNC capabilities to oversee every stage of the encapsulation process. This allows us to create custom encapsulations designed to maximize the effectiveness of your components, sub-systems, and systems. We also provide EMI/RFI interference shielding services and product designs compliant with Federal Information Processing Standards (FIPS) compliance.

Learn More About Our Design and Prototyping Services

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Conformal Coating Services

Plasma - Brush Conformal Coating Services

Conformal coatings are needed to insulate and extend the lifespan of your PCBs and other intricate electrical components. As a global leader in conformal coating services, Plasma Ruggedized Solutions provides you with the most effective NADCAP, AS9100 and NASA-certified coating services available. Additionally, our extensive knowledge in the protection of circuit board assemblies allows us to protect your circuitry to Federal Information Processing Standards (FIPS).

Parylene Coating Services

Plasma - Parylene Conformal Coating

Discover the exceptional benefits of Parylene conformal coating, a cutting-edge technology used across industries to safeguard and enhance the performance of vital components, devices, and surfaces. Unlike traditional coatings, Parylene coating is created at room temperature, eliminating the need for a liquid phase during application. This unique feature enables the coating to penetrate even the narrowest spaces, as small as 0.01mm, providing comprehensive and uniform coverage.

Potting and Encapsulation

Plasma - Electronic Potting and Encapsulation

Electronic potting and encapsulation involve filling or encapsulating an electronic assembly with a compound to protect the components from shock and vibration, corrosion, and contaminants such as dust, moisture and chemicals. The potting electronics process also protects components from security threats, such as tampering or reverse engineering.

LED Conformal Coatings and Encapsulation Services

Plasma - LED & Electronic Conformal Coating Services

Plasma Ruggedized Solutions can apply several types of coatings to Light Emitting Diodes (LED’s), including parylene. These electronic encapsulation processes offer superb protection for your products and will lengthen their working life.