ruhlamat GmbH products

The PowerSeal sets new benchmarks for high-speed encapsulation of chip modules: extremely compact and powerful, with a throughput of up to 40,000 modules/hour using two 16-fold dispensing heads and UV LED curing technology. UV LED curing saves production cost by lower energy consumption and long LED lifetime without aging. The curing is much faster compared to standard UV discharge lamps and the start-up time is reduced by providing full power directly after switching on. This enables high-speed production with significantly lower cost per module, resulting in an unsurpassed value for money. Alternatively, the machine can also be equipped with UV discharge lamps or heating units. Diverse nozzle plates are available for the different module tape pitches. Thermal curing resins such as black epoxy can be processed optionally. Reliable process stations and automated inline quality control ensure highest quality at a minimum of cost per module.

The PowerTest is a sophisticated testing and encoding system for chip modules on 35 mm tapes. Maximum flexibility allows versatile use: It can be used by card manufacturers for the incoming inspection or encoding of chip module tapes, and with integrated disconnect station by module tape manufacturers as a quality measurement system for the inspection of outgoing goods. Testing of contact, contactless and Dual Interface IC modules can be executed with the highest performance and yield by processing of up to 128 modules in parallel. In addition to basic test and parameter test, software is also available for chip module initialisation, personalisation, and OS loading. Integration of SAM, HSM, or similar modules can be realised easily. Using high-end reader technology from Smartware or Micropross, this automatic IC module test handler offers unmatched performance for the complete production test of smart card and RFID modules.