377H - Brochure

EPOXY TECHNOLOGY, INC. 14 Fortune Drive, Billerica, MA 01821-3972 Phone: 978.667.3805 Fax: 978.663.9782 www.EPOTEK.com Epoxies and Adhesives for Demanding Applications™ This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as to its accuracy and assumes no liability in connection with any use of this product. Rev. IV Oct 2012 EPO-TEK® 377H Technical Data Sheet For Reference Only Graphite-Filled, High Temperature Epoxy Number of Components: Two Minimum Bond Line Cure Schedule*: Mix Ratio By Weight: 1:1 150°C 1 Hour Specific Gravity: Part A 1.29 Part B 1.33 Pot Life: 24 Hours Shelf Life: One year at room temperature Note: Container(s) should be kept closed when not in use. *Please see Applications Note available on our website. Product Description: EPO-TEK® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, medical, and optical / OEM / fiber optics. It is an electrically conductive version of EPO-TEK® 377. EPO-TEK® 377H Advantages & Application Notes: ? Low viscosity - ideal for commercial and micro-dispensing applications. ? Suggested applications: o Opto-electronics: Adhering IR filter windows to cap of TO-can; opaque epoxy resin in IR and VIS range; near hermetic sealing of windows and packages. o Hybrid Microelectronics: adhesion to kovar, stainless steel, ceramics, glasses, lids or substrates in Rf/Microwave devices. ? Convenient 1:1 mix ratio allows for static mixing, or specialty packaging in double-barrel syringes. Typical Properties: (To be used as a guide only, not as a specification. Data below is not guaranteed. Different batches, conditions and applications yield differing results; Cure condition: 150°C/1 hour; * denotes test on lot acceptance basis) Physical Properties: *Color: Part A: Black Part B: Black Die Shear Strength @ 23°C: = 10 Kg / 3,400 psi *Consistency: Pourable liquid Degradation Temp. (TGA): 345°C *Viscosity (@ 100 RPM/23°C): 500 – 1,000 cPs Weight Loss: Thixotropic Index: N/A @ 200°C: 0.09% *Glass Transition Temp.(Tg): = 95°C (Dynamic Cure @ 250°C: 0.66% 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min) @ 300°C: 0.78% Coefficient of Thermal Expansion (CTE): Operating Temp: Below Tg: 56 x 10-6 in/in/°C Continuous: - 55°C to 175°C Above Tg: 200 x 10-6 in/in/°C Intermittent: - 55°C to 275°C Shore D Hardness: 80 Storage Modulus @ 23°C: 416,850psi Lap Shear Strength @ 23°C: > 2,000psi *Particle Size: = 40 Microns Optical Properties @ 23°C: Index of Refraction: N/A Spectral Transmission: < 0.1 % @ 400 - 1500 nm Electrical & Thermal Properties: Thermal Conductivity: 0.44 W/mK Volume Resistivity @ 23°C: = 400 Ohm-cm Dielectric Constant (1KHz): N/A Dissipation Factor (1KHz): N/A