920-FL_Datasheet

EPO-TEK® 920-FL Technical Data Sheet For Reference Only Thermally Conductive Epoxy Number of Components: Two Minimum Bond Line Cure Schedule*: Mix Ratio By Weight: 100:3 150°C 5 Minutes Specific Gravity: 120°C 10 Minutes Part A 2.52 100°C 20 Minutes Part B 1.02 Pot Life: 7 Hours Shelf Life: One year at room temperature Note: Container(s) should be kept closed when not in use. For filled systems, mix the contents of Part A thoroughly before mixing the two parts together. *Please see Applications Note available on our website. Product Description: EPO-TEK® 920-FL is a two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It is a low viscosity version of EPO-TEK® 920. EPO-TEK® 920-FL Advantages & Application Notes: • It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages, or a thermal potting compound. • Rheology allows for a smooth free flowing paste, which allows ease of use for potting and casting applications, as well as syringe dispensing. • Built-in color change from tan to an amber color. Suggested Applications: o Hybrids: thermal potting compound; potting connectors and potting transformers, mounting heat sinks to SMDs and ceramic circuits; potting, glob top protection over SMDs. o PCB Level: heat sinking adhesive; adhesion to Au, Cu, Al, FR4, many plastics, components and connectors. o Semiconductor: thermal management as semiconductor underfill or glob top encapsulant; potting IC packages like BGAs or CSPs. • Available in many intermediate viscosity ranges. Contact techserv@epotek.com for your best recommendation. • Low temperature curing < 120°C. Typical Properties: (To be used as a guide only, not as a specification. Data below is not guaranteed. Different batches, conditions and applications yield differing results; Cure condition: 150°C/ 1 Hour ; * denotes test on lot acceptance basis) Physical Properties: *Color: Part A: Grey Part B: Amber Die Shear Strength @ 23°C: = 20 Kg / 6,800 psi *Consistency: Smooth flowing paste Degradation Temp. (TGA): 362°C *Viscosity (@ 20 RPM/23°C): 8,000 – 12,000 cPs Weight Loss: Thixotropic Index: 3.1 @ 200°C: 0.20% *Glass Transition Temp.(Tg): = 90°C (Dynamic Cure @ 250°C: 0.28% 20—200°C /ISO 25 Min; Ramp -40—200°C @ 20°C/Min) @ 300°C: 0.48% Coefficient of Thermal Expansion (CTE): Operating Temp: Below Tg: 21 x 10-6 in/in/°C Continuous: - 55°C to 200°C Above Tg: 97 x 10-6 in/in/°C Intermittent: - 55°C to 300°C Shore D Hardness: 93 Storage Modulus @ 23°C: 783,073 psi Lap Shear Strength @ 23°C: > 2,000 psi *Particle Size: = 50 Microns Thermal Properties: Thermal Conductivity: 0.89 W/mK Electrical Properties: Dielectric Constant (1KHz): 5.96 Volume Resistivity @ 23°C: = 4 x 1013 Ohm-cm Dissipation Factor (1KHz): 0.009 EPOXY TECHNOLOGY, INC. 14 Fortune Drive, Billerica, MA 01821-3972 Phone: 978.667.3805 Fax: 978.663.9782 www.EPOTEK.com Epoxies and Adhesives for Demanding Applications™ Rev. II 08/2007 This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as to its accuracy and assumes no liability in connection with any use of this product.