930_Datasheet

Product Information Sheet MATERIAL ID: EPO-TEK® 930 Date: 08/2005 Per: Rev: IV Material Description: A two-part thermally conductive epoxy for heat sinking electronics and hybrids. It can be used at the PCB level for circuit assembly. Number of Components: Two Mix Ratio: 100:3.3 Cure Schedule (minimum) 150°C/10 Minutes - 100°C/4 Hours - 80°C/6 Hours Specific Gravity: --- Part A: 1.66 Part B: 1.02 Pot Life: 6 Hours Shelf Life: One year at room tempeature NOTE: Container(s) should be kept closed when not in use. Filled systems should be stirred thoroughly before mixing and prior to use MATERIAL CHARACTERISTICS: To be used as a guide only, not as a specification. Data below is not guaranteed. Different batches, conditions and applications yield differing results; Cure condition: 150°C/1 hour * denotes test on lot acceptance basis PHYSICAL PROPERTIES: *Color (before cure): Part A: White Part B: Amber Weight Loss: *Consistency: Granular paste @ 200°C: % *Viscosity (23°C): > 819,200 cPs @ 250°C: % @ 300°C: 0.86 % Thixotropic Index: N/A Operating Temp: *Glass Transition Temp: = 90 °C (Dynamic Cure Continuous: - 55°C to + 150°C 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min) Intermittent: - 55°C to + 250°C Coefficient of Thermal Expansion (CTE): Storage Modulus @ 23°C: 1,313,918 psi Below Tg: 16 x 10-6 in/in°C Ion Content: Above Tg: 81 x 10-6 in/in°C Cl-: Shore D Hardness: 82 NH4+: Lap Shear @ 23°C: 658 psi Na+: Die Shear @ 23°C: = 5 Kg / 1,700 psi K+: Degradation Temp: 350 °C *Particle Size: = 500 microns ELECTRICAL AND THERMAL PROPERTIES: Thermal Conductivity: 4.57 W/mK Dielectric Constant (1KHz): 3.96 Volume Resistivity @ 23°C: = 2x1013 Ohm-cm Dissipation Factor (1KHz): 0.006 OPTICAL PROPERTIES @ 23°C: Spectral Transmission: N/A Index of Refraction: N/A EPOXY TECHNOLOGY, INC. 14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782 WEB SITE: www.epotek.com Document No. 43 Rev. D