Alpha - Model OM-535 - Lead-Free Zero-Halogen Solder Paste for Low Temperature Reflow Applications Brochure

ALPHA OM-535 was developed with the aim to improve the solder joint performance, both for drop shock and thermal cycling, versus the existing low temperature products on the market. The enhanced properties of low temperature SBX02 alloy combined with the advanced  chemistry performance of OM-535 enables  the formation of a better solder joint  by improving the mechanical performance and solder joint cosmetics using low temperature process settings.