BondHub II - Brochure

C-Scan (XY-encoded) imaging capability of all 3 available bond testing modes: Resonance, Pitch-Catch, Mechanical Impedance No couplant required for Pitch-Catch and MIA modes Full-field inspection coverage and data reproducibility Time and thus cost savings by conducting full data review after scan is completed versus during inspection Data recording, post-processing, analysis, reporting, archiving Increased probability of detection Easy interpretation Faster and more reliable inspection Reduced human error influence Quantitative defect sizing Portable system including large sun readable display Fully battery operated Manual and automatic scanners available CompVu reader software available for remote data processing