EddyCus TF lab Brochure

The EddyCus® TF lab (Thin-Film) is especially designed for contactless real-time thickness and sheet resistance determination of low and high conductive thin-films on glass, wafer, plastics or foils. Further the device is applicable for real-time wall thickness measurements of conductive materials such as metal foils and sheets. A non-contact testing is especially required when characterizing high sensitive thin-film, when testing concealed conductive layers or when testing encapsulated layers. The system is delivered with an easy to handle software that provides pre-saved calibration for wall thickness, thin-film thickness or sheet resistivity measurements or requested applications. Furthermore, the software supports quick re-calibration for specific application to extend the field of use after delivery. SURAGUS GmbH Maria-Reiche-Str. 1 01109 Dresden Germany E-Mail: info@suragus.com Phone: +49 (0) 351 273 598 01 Fax: +49 (0) 351 329 920 58 www.suragus.com Testing of conductive layers. EddyCus® TF lab Measuring Thickness & Sheet Resistance SURAGUS GmbH | Maria-Reiche-Str. 1 | D-01109 Dresden | Germany | Phone +49 351 273 598 - 01 | Fax + 49 351 329 920 - 58 | info@suragus.com | www.suragus.com DATA SHEET EddyCus® TF lab - Measuring Thickness & Sheet Resistance PERFORMANCE & SETUP EddyCus® TF lab Sheet resistance measurement Eddy current sensor Substrate thickness measurement Ultrasonic sensor resolution Substrate area 200 x 200 mm² Max Sample thickness (defines distances) 5 / 15 / 25 / 45 / 60 (defined by the thickest sample) Sheet resistance range 0.001 – 10 Ohm/sq < 2 % accuracy 10 – 100 Ohm/sq < 3 % accuracy 100 – 1,000 Ohm/sq < 5 % accuracy Thickness measurement of thin-films (e.g. cooper) In accordance with sheet resistance ? Real time depiction of sheet resistance or thickness ? Collection of data sets, saving and data export function ? Software shows immediately sheet resistance, thickness and substrate thickness ? Metallic layers (Cu, Al, Ag,...) ? TCO (ZnO, ITO, SiO2) ? Carbon nanotubes (CNT) ? Silver nanowires ? Graphene ? Doped layers and materials (wafer) ? Sheet resistance monitoring [Ohm/sq] ? Thin-film thickness monitoring [nm] ? Wall thickness monitoring of low and high conductive substrates [µm] THIN-FILMS CHARACTERIZATION ? Doped silicon wafer ? Conductive foils ? Conductive tapes and mats SUBSTRATE CHARACTERIZATION SOFTWARE AND HANDLING CHARACTERIZATION MODE