Fully Automated Wafer Metrology For Advanced Packaging - Brochure

As wafer level packaging (WLP) and heterogeneous integration (HI) approaches gain more relevance, metrology processes begin to creep into back-end process control, where measurement becomes trickier and more diversified. The dawn of fanout (FO) processes both at the wafer and panel level has added more diversity to metro logy needs. The addition of 2.5D and 3D heterogeneous integration, and now chiplet techno logies further expands the diversity of applications. FormFactor’s FRT Metrology offers integra ted solutions for these challenging tasks. We are able to accommodate measurement requirements for the most varied processes and to handle wafers and panels, thinned and bonded wafers, and also film frames.