Fundamental and Practical Insights on Stress Evolution during Thin Film Growth - Brochure

Understanding the origin of stress in thin films produced by physical vapor deposition (PVD) is of key importance as excessive stress levels can lead to premature failure by cracking, buckling or interfacial delamination, which compromises device durability. This webinar will provide an overview on how film stress develops during deposition, how it is affected by the main process parameters, and how to mitigate it. Selected examples from epitaxial, amorphous and polycrystalline thin films will be highlighted, with emphasis on metallic thin films. Models explaining the generation and relaxation of stress will be presented and discussed. The webinar will also cover practical aspects on how to measure stress during growth using wafer curvature methods.