Heraeus - SolderPro Series - Microbond Assembly Materials Brochure

Microbond Assembly Materials SolderPro Series – Perfection is not a matter of luckThe SolderPro F64* family of solder materials, all with the same flux system, offers outstanding wetting on new PCB finishes such as NiAu, NiPdAu and NiPdHeraeus’ new SolderPro Series technology addresses today’s challenges in both processing and reliability. It offers wide processing windows, is specially formulated to address the soldering issues of nickel-based surfaces in air environments and offers complete compatibility among all fluxes used in the assembly process. These properties insure well formed joints that exhibit long term mechanical and electrical reliability. The SolderPro family of solder ing solutions is available in all commercial alloys such as SAC305/405/0307, SnAg3.5. The Heraeus SolderPro Series offers a family of products to suit all soldering process needs, including: The SolderPro Series F640SAC for printing The SolderPro Series F640SAC for dispensing The SolderPro Series SF64 flux for rework The SolderPro Series W640SAC wire for rework and special applicationsSolderPro Series – F645SAC Printing Paste F645SAC solder paste combines environmental friendliness with performance. It is completely halide and halogen-free, and is ideal for challenging applications, such as Au-wire bonding near solder joints.F640 Flux characteristic Many lead frame and passive components are migrating to final finishes that use nickel as a barrier layer and plate Sn, Pd, Au or PdAu on top of it. Small imperfections in the plating expose the nickel and impair its solderability. The SolderPro Series F64* family is formulated with a special activator mixture that ensures good wetting to partially oxidized nickel surfaces, providing higher yields and less rework than competitive products. The flux packageis capable of completely removing all existing oxidation on difficult-to-wet surfaces, even in air reflow environments. SolderPro Series – F640SAC Printing Paste A top solder paste in automotive and other demanding industries, F640SAC has superior wetting to all types of PWB and component surface finishes, especially newer ones that use nickel.SolderPro Series – F640SAC Dispensing Paste The dispensable F640SAC solder paste uses the same flux as the printing paste, but optimizes its flow charac teristics for dispensing. It is available in different cartridges, e.g. 10 and 30ml.SolderPro Series – SF64 Flux SF64 flux is a halide and halogen-free paste flux for all types of repair from hand soldering to automated rework stations. It is designed to provide excellent soldering to a variety of surfaces, including Sn, NiAu, Cu-OSP, Ag and SnPb. It is 100% compatible with F640SAC solder pastes.SolderPro Series – W640SAC Wire W640SAC wire is a halide and halogen-free solder wire for manual or automatic processes. It uses the same flux system as the SolderPro F640SAC solder paste, ensuring compatibility and eliminating the reliability concerns of mixing different flux formulations. It provides maximum wetting capability while producing low smoke and odor.Excellent wettingF640 powder type 3Excellent wettingF640 powder type 4Poor wetting, failWetting on nickel plate in airCompetitor wetting on nickel plate in airExample of a chipcomponent with an imperfect Sn surface finish – darkspots are exposed nickelHeraeus Materials Technology GmbH & Co. KGContact Materials DivisionMicrobond Assembly MaterialsHeraeusstr. 12–1463450 Hanau, GermanyPhone +49 6181.35-5465Fax +49 6181.35-7860cmdinfo@heraeus.comwww.heraeus-contactmaterials.comThe data given in this brochure are valid for November 2011. Subject to alterations.E 1M 11.2011/VN Printed in GermanyThe descriptions and engineering shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled according to the latest factual knowledge in our possession. The information was up-to-date on the date this document was printed (latest version can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or any patent intringement resulting from its use (unless this is contractually and explicity agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for a particular application.