mAgic - - Microbond Assembly Materials Brochure

mAgic Sinter MaterialsMicrobond Assembly Materials has established the mAgic product brand in 2010 for lead-free sintering pastes and sintering adhesives. Based on the highest thermal require- ments of our Direct Copper Bonding (DCB) customers, the earliest sinter products developed in 2009 already provided superior thermal and electrical performance. These products have been in use for more than 2 years in the industry and demonstrate their performance in high power circuits every day. As a leading materials supplier for the die attach industry we are developing new lead-free solutions for lead frame applications utilising our experience in the field of DCB applications. The replacement of high lead solders is one of the biggest challenges today. The mAgic sinter materials provide the potential to replace lead-containing solders in current discrete power devices. Devices built with mAgic paste will have superior thermal and electrical performance and comply with future legislations. The sinter concept can also be used to improve the performance of existing die attach adhesives, leading to higher electrical and thermal conductivity. This new product series called mAgic sinter adhesive combines the strength of die attach epoxies and solders. It provides the flexibility and low process temperature of adhesives and at the same time shows a thermal conductivity comparable to solders.The mAgic product technology platform, consisting of sinter pastes and adhesives, will cover existing and future requirements for medium and high power packages. 47107.86mAgic Sinter Materials Heraeus Materials Singapore Pte LtdContact Materials DivisionMicrobond Assembly Materials Corporation Place, Lobby A #6No. 2, Corporation RoadSingapore 618494Phone: +65 6571 7677Microbond Silver Interconnectic47107.86Different demanding applications require dedicatedsolutions. The key requirements for DCB application is high reliability, increased lifetime and low thermal resistance. The main driver for discrete power packages is the need for a lead-free die attach material and highly flexible processing options.On the other hand the manufacturers of IC packages are looking into material solutions providing higher reliability that do not require new processes or equipment. For all of these different demanding requirements mAgic offers a material solution. Heraeus Materials Technology GmbH & Co. KGContact Materials DivisionMicrobond Assembly MaterialsHeraeusstr. 12-1463450 HanauPhone +49 6181 35-5465www.heraeus-contactmaterials.comSinter Pastes Sinter AdhesivesCar Head LightsPower ConverterPower AsicsGear ControlElectrical Power Steering ModulesBatterie ManagementChargersElectronic SwitchesStreet LightAdvantages in demanding applicationsDirect Copper Bonding increases lifetime > 3 times reduction in process cost – reduced cleaning steps operation temperature > 200°C possibleDiscrete Power Packages Pb free – complying with future environmental legislation improves thermal and electrical conductivityHigh Brightness LED increases lifetime and light emission material performance superior to AuSn die attach materialHybrides combination of logic and power electronics on hybrides Properties (processed material) Sinter Paste Sinter Adhesive Ag content (wt %) 100 90 ± 1 Electrical resistivity (m? cm) = 0.01 = 0.05 Thermal conductivity (W / m·K) = 100 = 30 Glass transition point (°C) n / a 38 CTE (ppm / K) = 25 48 / 113 Process temperature (°C) 220 180 – 200 Shear strength (N / mm2) = 10 = 10 E-Modulus @ 25 °C (GPa) > 35 4.2IC Packages increase of power density improved electrical performanceThe data given in this brochure are valid for November 2011. Subject to alterations.E 2C5X 11.2011/N Printed in Germany