NDT Systems Bondascope 3100 Brochure

The Bondascope 3100 is an advanced ultrasonic bond tester that uses 3 different operating modes to cover a multitude of applications. Compared to conventional UT, the lower frequencies of 20 kHz-400 kHz enable deeper penetration through attenuative materials, across multiple glue lines or even sandwich cores to detect far-side defects. The various display modes are optimized for different applications with a selection of gates and alarms to easily identify a flaw.