Nordson - Model AMI SpinSAM - Automated Inspection Tool - Brochure

The SpinSAM automated inspection tool delivers high throughput and better sensitivity for accurately locating defects in wafer based assemblies. Ideal applications include bonded wafers, Chip-on-Wafer, stacked wafers, MEMS, over-molded wafers and more. Efficiently spin scan up to 4 wafers simultaneously with 4 matched transducers, wafers can be inspected over the widest frequency range ever achieved in a production environment. Waterfall transducer provides non-immersion scanning which minimizes risks of contamination and false bond indications.