PC-cluster for LEEPL-PATACON

1 of 18Data Formats and Functions SupportedP20-5M13M-LEEPL-ELEEPL processing- Field division by processes- Complementary division- Flap addition- COSMOS placement/Strutpattern generation- Stress distortion correction- Alignment mark insertionPATACON PC-cluster for LEEPL is a for converting semiconductor mask CAD data tothe EB data of masks for LEEPL transcribing devices. This software has several functions, for examplepattern placement function corresponding to the structure of the LEEPL mask, which is different from themask for optical steppers, complementary division function for stencil masks, correction of distortion due tomask internal stress, and alignment mark insertion. This software operates in the environment in whichseveral to some hundreds of Linux PC's are connected by a high-speed network.PRELIMINARYFracturing treatment- Mirror, rotate, scale- Boolean operation, resizing- Pattern fracturing- Small-figure treatment- Format conversion- Proximity effect correction- Extraction of aperture patternfor cell projection exposureNIPPON CONTROL SYSTEM CORPORATIONSample hardware configurationSample hardware configurationInput data- GDS-II- OASIS(*2)- MEBES(*1)- MEBES mode5(*1)- JEOL52- JEOL52V1.1- JEOL52V2.1- JEOL52V3.0- JEOL52V3.1- HL-700- HL-800- (HL-900)- HL-7000- VSB11- VSB12- BEF(Advantest)Output data- GDS-II- OASIS(*2)- MEBES- MEBES mode5- JEOL52- JEOL52V1.1- JEOL52V2.1- JEOL52V3.0- JEOL52V3.1- HL-700- HL-800- (HL-900)- HL-7000- VSB11- VSB12- BEF(Advantest)*1 Data format cannot be converted from MEBES to other EB data. *2 Under planning.2 of 181. LEEPL Data Conversion FlowPATACON PC-cluster for LEEPL is a system, which is based on PATACON PC-cluster andhas additional functions necessary for EB data creation for LEEPL masks. Data can beconverted from CAD data to mask writing data straightforward without creating anintermediate data file such as GDS-II. In addition, data before correction for manufacturinga mask can also be output simultaneously for mask inspection. - Boolean operation- Resizing- Small-figure treatment- Data compression- Format conversion- Complementary division- Flap additionCAD data - Alignment mark insertion - Inspection data creation- Membrane design- strut data generation- ComparativeverificationCOSMOS placement- Stress distortion correctionMask writing dataMaskinspection data- Scale, mirror, rotate- Boolean operation, resizing- Field division for each processeA B C DStrut data3 of 182. Features of LEEPL ProcessingSince masks for LEEPL have specific structures, the dedicated functions below are added to theconventional data conversion processing for photo-masks.- Function for assigning pattern data to fields for each process- Function of complementary division for manufacturing stencil masks- COSMOS placement function and strut data generation function for placing patterns accordingto the COSMOS structure- Flap addition function- Stress/gravity distortion correction function- Alignment mark insertion function- Mask inspection data output function2.1 Function for assigning pattern data to fields for each processThis function distributes pattern data to each area called process field divided by a strut which has awidth. If a pattern extends over the border but it is contained in the overlapping area, the pattern is notcut off and contained in either field. Left field Right field2.2 Function of complementary division for manufacturing stencil masksSince masks for LEEPL are stencil masks, doughnut patterns cannot be formed. In addition, since themembrane structure is very thin, the mask may be broken if a long thin pattern, leaf pattern, or large-area pattern is applied. For such a pattern, inconvenience with mask creation is avoided by dividingthe pattern to more than one figure and distribute them to different membranes. In this case, patternsare divided as follows:- Patterns are divided at an apex so that the number of figures does not increase unnecessarily.- Adjoining patterns are assigned so that they are placed on different membranes.- L&S patterns are divided by the length according to the interval.- L&S patterns are divided with adjoining dividing positions shifted.- Patterns are not cut off in a specified division prohibited area.4 of 18Conversion parameters for complementary division(1) Small patternif MAX(W,H) < N um,then not divide patternHWif MAX(W,H) > N um andMAX(W,H) / MIN(W,H) >= RATIO,then divide pattern(2) Long line patternWH-->if Area*H/W > N um2,then divide pattern(3) Leaf 1123456789012345123456789012345123456789012345123456789012345123456789012345123456789012345123456789012345123456789012345123456789012345123456789012345HW-->(4) Leaf 21234567890112345678901123456789011234567890112345678901123456789011234567890112345678901123412341234123412341234121212121212 1234561234561234123412341234HWif Area*H/W > N um2,then divide pattern-->if Area > N um2 and Area / (W*H) > RATIO,then divide pattern(5) Large area patternWH-->(6) Branch patternif MAX(W,H) > N um,then divide patternWH-->5 of 18Sample complementary divisionEx. Leaf pattern Ex. Leaf patternEx. Doughnut pattern Ex. L&S6 of 182.3 COSMOS placement function/strut data generation for placing patterns according to theCOSMOS structureThere are two types of masks for LEEPL. One is a COSMOS mask with a strut structure and the otheris a mask with no strut structure. PATACON PC-cluster for LEEPL corresponds to the mask of eitherstructure.For the COSMOS mask, strut pattern data for creating mask blanks with strut structures can be outputas mask writing data.For a COSMOS mask, a pattern is divided into two to four complementary sections and placed in amembrane. Membranes that can be placed for the respective COSMOS placements are as follows:AC DACAC D C DADBC DBCC DBC DBDA BC DA BCAC DBC DA BDA BCA BCACBCA BA BDA BADBDA BDA B BDCAC DCOSMOS-I placement COSMOS-II placementCOSMOS-I's placeable membranes COSMOS-II's placeable membranes7 of 18Ex. Data consisting of equally spaced rectangles are placed on applicable membranesEx. Membrane assignment sample (example of complementary division into four)Ex. Membrane assignment (example of complementary division into three)COSMOS-I placement COSMOS-II placementResult of complementary division Placement after complementary divisionResult of complementary division Placement after complementary division8 of 18Ex. Membrane assignment sample (example of complementary division into two)Ex. Strut pattern generationResult of complementary division Placement after complementary divisionCOSMOS-I placement COSMOS-II placement9 of 182.4 Flap addition functionA flap additional pattern is added to the joint so that any gap is not generated when a pattern divided bydivision of process fields or complementary division is exposed. Two types of additional patterns beloware available.(1) Rectangle(2) Trapezoid- An additional pattern is added only when a pattern is divided at a straight stick part.- The shape of the additional pattern is specified for each length of the divided edge.- For the additional pattern, retraction from the divided edge can be specified.- When a T or L-character part is cut off, the tip of the stick is prolonged for the specified length.- In other cases, the tips of both the sides are prolonged for a half of the specified length.In addition to this, you can also specify a process for prolonging the tip of a long line pattern.Ex. Flap addition2.5 Stress distortion correction functionThis function predicts pattern shift due to stress from the mask beforehand to correct the position ofthe pattern placed on the mask. Correction is applied in the following two cases:Cut edge length = 60 nmEdge to upper base = 0 nmEdge to lower base = 0 nmHeight = 10 nmDent depth = 0 nmCut edge length = 60 nmOverlap width = 20 nmEdge width = 60 nmProlonged length = 20 nmShift depending on the stressof the whole maskShift depending on the pattern distributioninside of the strut10 of 182.6 Alignment mark insertion functionThis function inserts alignment marks into the following places.- Strut part out of the membrane area or mask circumference part- In the membrane area2.7 Mask inspection data output functionFor the inspection device of masks for LEEPL, this function outputs conversion data before correctionfor mask manufacturing in an EB data format.2.8 Verification function- This function verifies input CAD data and output EB data.- This function moves and overlaps the pattern data placed on membranes, and compares them withinput data to check if there is a dropped pattern or overlap.11 of 183. Features of Mask FracturingMask fracturing converts CAD data into EB data for various mask writers. In addition, thisfunction can generate a new layer by applying Boolean operation to CAD data, and applycorrection to existing EB data, such as resizing, shrinking, and tone reversal.3.1 High-speed processingPATACON PC-cluster operates established PATACON mask fracturing software on a general-purposeLinux PC, and moreover operates several to some hundreds of Linux PC in a cluster environmentconnected by a high-speed network. Processing speed is almost proportional to the number of theLinux PC's by using the NCS's own parallel processing technology, which has been developed for longyears.3.2 Support of large-scale dataThis system can support CAD data and EB data for LSI whose scale of integration grow dramatically.Some hundred gigabytes of CAD data and EB data can be processed.3.3 Conversion emphasizing writing quality and high-speed writingWriting quality and writing speed are greatly influenced by the way of pattern decomposition in somewriting strategies of electron beam writer. This system aims at high-quality high-speed writing by makinga close technical collaboration with users. This system corresponds to the downsizing of mask patternsthat will progress increasingly and particularly emphasizes the small-figure treatment.- Small-figure treatment (JEOL52V1.0/V1.1/V3.0/V3.1, HL-700/800/900/7000,VSB11/12)In the data conversion phase, this system decomposes a CAD pattern into rectangles and trapezoidswriters can accept. As pattern sizes are reduced increasingly, the way for decomposing a patternand small-figures generated by pattern decomposition have an adverse impact upon writing quality.This system decomposes figures so that the generation of a small-figure is minimized and writingquality is kept best even if a small-figure is by all means generated. This small-figure treatment isapplied not only to field boundaries but also field insides.3.4 Automatic data compaction and automatic library generationThis system compacts data automatically when outputting converted EB data. A library is automaticallygenerated not only for MEBES output but also JEOL52V1.0/V1.1/V3.0/V3.1 output, HL-700/800/900/7000 output and VSB11/12 output, so that data are automatically compacted without getting help fromsomeone.3.5 Extraction of aperture figures for cell projection exposureFor writers with a cell projection exposure function, this system is equipped with a function for extractingpatterns from pattern data, which are put on the aperture mask.12 of 183.6 Highly reliable pattern processingSince this system performs highly reliable processing for data including arbitrary angles and othercomplicated figures, you can use this system for mask manufacturing at ease.3.7 Plural job execution managementPATACON PC-cluster can execute more than one job simultaneously. In addition, the priority of eachjob can be changed or aborted even while a job is being executed.3.8 Graphic displayFor displaying input and output data, this system has a variety of display functions such as outline display,paint-out display, magnification/reduction display, display of overlaid layers, small-figure display, griddisplay, and line-width measurement with the cursor. It is the merit of these functions that extensivedata can be displayed rapidly.3.9 Counting up of operation recordThis system counts the number of jobs, processing time (entry, operation, and output), the number offigures, data volume, operating time, down time, and availability in the form of daily report, weekly report,and monthly report. In addition, this system can also count information on a specified job. You cangrasp operation status and get information for accounting by this function.3.10 User interface consistent with user operation formsThe specification of required user interface varies considerably according to the objectives of the systemuse and operation form. This system is equipped with standard window interface, however, NCSdevelops customized interface as well. In addition, NCS develops an automatic generation tool ofcommand files.- Window interface for specific users (special order for value)This service changes the parameter setup method of standard window interface according to therequests from users.- Command automatic generation program (special order for value)This program generates "command files" for making this system convert data from a user's CADdatabase or command files of the existing system.3.11 Plenty utility programsPlenty utility programs are available, for example data analysis tools for GDS-II, MEBES, JEOL52V1.0/V1.1/V3.0/V3.1, HL-700/800/900/7000 and VSB11/12.13 of 184. Commands and SubcommandsDedicated commands and subcommands are added to the command system of theconventional mask fracturing to realize data conversion for LEEPL.4.1 Commands and subcommands for LEEPL processing(1) Data conversion command for LEEPL [.LEEPL]Subcommands(a) AL mark pre-calculation specification ---------------------------------- CALMARK(b) AL mark dedicated conversion specification ------------------------- CONVMARK(c) AL mark reference specification --------------------------------------- USEMARK(d) Input/output table specification ----------------------------------------- TBLNAME(e) Division prohibited area table specification---------------------------- DIVDISABLE(f) PUF offset specification -------------------------------------------------- PUFOFFSET(g) COSMOS placement specification -------------------------------------- COSMOS(h) Parameter file specification ---------------------------------------------- PRMFILE(i) Reticle size specification ------------------------------------------------- RETICLESIZE(j) AL mark pre-calculation by shapes specification --------------------- ALPAT(k) AL mark individual reference specification --------------------------- ALREF(l) Chip division specification ----------------------------------------------- DIVIDECHIP(m) Whole mask distortion correction specification ----------------------- MASKCRR(n) Distortion correction by membranes specification ------------------- MEMBCRR(2) Boolean operation command [.OPERATE]Subcommands(a) Return post-Boolean operation table to layer table ------------------- MKLAYER4.2 Details of LEEPL processing commands and subcommandsFor details, refer to PATACON-LEEPL Command Specifications.14 of 18List of main commands and subcommandsCommand Subcommand Function.INIT -------- Job initialization.DEFINE OUTTYPE Defines output format and detailed informationCHECK Defines input data checkingDefine parameters SIZE Defines a chip sizeGRID Defines grid processingMT Defines information on MTOPTION Defines option informationOVERLAP Defines the size of overlap in resizingDIVIDE Defines the division of the area to be processedCUTANGLE Defines the standard angle for the sharp tip cut in resizing.INPUT -------- Enters data.LAYER USE Defines the input data tableUSEF Defines the input data fileDefine the layer WINDOW Defines the area for processingto be used BLANK Defines the non-processed areaMOVE Moves the pattern dataROT Rotates the pattern dataMIRROR Reverses pattern data to a mirror imageARRAY Arrays the pattern dataMAG Magnifies/reduces the pattern dataMAIN Defines the main structureLAYNO Defines a layer number to be usedTLAYNO/FLAYNO Defines a specific layer number (text/pattern).OPERATE AND Calculates AND between layersOR Calculates OR between layersExecute data processing SUB Calculates SUB between layersNOT Calculates NOT between layersNOR Calculates NOR between layersNAND Calculates NAND between layersXOR Calculates XOR between layersRESIZE Resizes the layerCONVERT Converts the formatLFREE Frees the temporary layer tableTBLSIZE Checks whether the temporary layer table is blank or notLAYDISP Displays the layer* MKLAYER Returns a table after Boolean operation to a layer table* PCONVERT Converts the format (with PEC for mask writers).OUTPUT COMMENT Gives comments to output dataOUTTBL Defines the output table nameOutput HLCONDITION Defines the condition of conversion for HL in the output fileprocessing results SHOTRANK Adds shot rank information to JEOL52 outputPATTRD Defines JEOL52 V1.1 PREAD compatible outputSPPRM Defines the PATTRD parameterCONDITION Defines the conditions of conversion for JEOL52 V1.1 in the output file15 of 18Continued from the previous pageCommand Subcommand Function* .LEEPL * CALMARK AL mark pre-calculation specification* CONVMARK AL mark dedicated conversion specificationLEEPL conversion * USEMARK AL mark reference specification* TBLNAME Input/output table specification* DIVDISABLE Division disabled area table specification* PUFOFFSET PUF offset specification* COSMOS COSMOS placement type specification* PRMFILE Parameter file specification* RETICLESIZE Reticle size specification* ALPAT AL mark pre-calculation by shapes specification* ALREF AL mark individual reference specification* DIVIDECHIP Chip division specification* MASKCRR Whole mask distortion correction specification* MEMBCRR Distortion correction by membranes specification.LIST -------- Outputs a table list.FREE -------- Frees the table.SEARCH -------- Searches pattern information.RESTART -------- Resumes processing after temporary suspension.CEND -------- Ends the command sentence.END -------- Ends the jobThe command specified with a * mark is a command and subcommand for the LEEPL processing.Available commands and subcommands vary according to the system configuration.Special commands (pseudo-commands);@MKFRAME Adds frame data for negative resizing;@STARTDIV, ;@ENDDIV Divides the chip;@CHECKON, ;@CHECHOFF Turns on/off syntax checking temporarilyCommands for the job execution program%LD Reads a command file to execute it%ON_ERROR_GOTO Jumps when an error occurs%GOTO Jump%END Finishes executing a command file%LG Specifies a default log file name Executes a UNIX command16 of 185. Operation EnvironmentThis software operates in a cluster environment, in which several to some hundreds of LinuxPC's are connected by a high-speed network. Processing speed is almost proportional tothe number of the Linux PC's by using the NCS's own parallel processing technology, whichhas been developed and improved for long years.- Linux PC configurationSince the license fee of the software is determined according to the number of CPU's used, it isrecommended to use high performance latest hardware. For details, contact our company.Sample large-scale configurationSample small-scale configuration Sample medium-scale configurationClient Client??·???Client Client1st LAN2nd LAN (Gigabit)ClientServerClient1st LAN2nd LAN (Gigabit)2nd LAN (Gigabit) 2nd LAN (Gigabit)Sub-server Sub-serverServerClient Client2nd LAN (Gigabit)Sub-server1st LANClient Client2nd LAN (Gigabit)Server- Server: Manages the whole system, prepares/distributes entry data, and coordinates output data- Client: Converts assigned data- Server: Manages the whole system, prepares/distributes entry data, and coordinates output data- Sub-server: Distributes entry data- Client: Converts assigned data17 of 186. Software License and Sales Form6.1 Software license feeThe license fee of the software is determined according to the number of CPU's used. For details,contact our company.6.2 Sales/maintenance stylesSales/maintenance style 1: software + hardware (configured with the commercial PC servers NCSrecommends)- The hardware NCS recommends is adopted and delivered as a system with the software installed.- The software and hardware are guaranteed and maintained together.- NCS always keeps hardware spare parts available in the office.Sales/maintenance style 2: software + hardware (configured with the products you specify)- The hardware you specify is adopted and delivered as a system with the software installed.- The hardware is delivered as resale.- NCS guarantees and maintains the software only. For the maintenance of the hardware, contact thehardware manufacturer directly.Sales/maintenance style 3: software only- NCS sells the software only.- The software is installed in the hardware you prepare.- The software is installed for value.- NCS guarantees and maintains the software only. For the maintenance of the hardware, contact thehardware manufacturer directly.18 of 18System specifications are subject to change without notice for improvement.Development and sale: Nippon Control System Corporation- Head Office:1-19-15 Ebisu, Shibuya-ku, Tokyo, 150-0013, Japantel: +81-3-3443-5081 fax: +81-3-3443-5189- Shin-Yokohama Office:2-7-9 Shin-Yokohama, Kouhoku-ku, Yokohama-shi, Kanagawa, 222-0033, Japantel: +81-45-477-5800 fax: +81-45-477-5811For this product, please contact the Shin-Yokohama Office.Email: horiuchi@nippon-control-system.co.jpContent of this catalog: as of April, 2004 P20-5M13M-LEEPL-E