UniTemp - Model RSS 3X210-S - Vacuum Reflow System - Brochure

Vacuum Reflow System with SIMATIC© control for substrate size up to 3 x (200 x 200 mm) Lift pins for wafer lift up and down. The RSS-3X210-S Reflow Solder System is a very compact and easy useable tool for the use in laboratories and clean rooms as table top unit. The chamber is vacuum sealed and equipped with a viewing window. This allows the view control of the soldering process. The unit is standard equipped with a Mass Flow Controller for the process gas.