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King-Credie - Model RO4003C -4 Layer PCB Circuit Boards
Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics with the electrical performance of PTFE/woven glass and the manufacturability of epoxy/ glass.
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Dk of 3.38 +/- 0.05
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Dissipation factor of 0.0027 at 10 GHz
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Low Z-axis coefficient of thermal expansion at 46 ppm/°C
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Ideal for multi-layer board (MLB) constructions
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Processes like FR-4 at lower fabrication cost
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Designed for performance sensitive, high volume applications
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Competitively priced