- Home
- Equipment
Refine by
Epos Environmental Equipment & Supplies
6 equipment items found
Manufactured by:Epoxy Technology, Inc. based inBillerica, MASSACHUSETTS (USA)
A single component, thermally and electrically conductive, epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a pot-life of several days, low temperature cure and syringe dispensing rheology. It can be used for electrical connections when bonding chips, S2v£Ds: PCBs and ...
Manufactured by:Epoxy Technology, Inc. based inBillerica, MASSACHUSETTS (USA)
EPO-TEK EJ2189-LV is an electrically conductive, silver-filled epoxy. This two component system is designed for reliable low temperature ...
Manufactured by:KoCoS Messtechnik AG based inKorbach, GERMANY
EPOS 340 features four voltage signal sources and three current signal sources. The signal characteristics are computed by a high-performance signal processor and output via high-accuracy D/A converters and electronic power amplifiers. The amplitude, phase and frequency can be varied widely during ...
Manufactured by:Epoxy Technology, Inc. based inBillerica, MASSACHUSETTS (USA)
Category : Electrical. Conductivity : Electrical. Cure Type : Oven. Number of Components : 2. Pot Life Value : 24 hrs. Viscosity Value : 500-1,000cPs @ 100 rpm. Tg Value : ≥95°C. Thixo Value : N/A. Recommended Cure : 150°C/1 hr. Die Shear Strength : ≥10 kg. Thermal Conductivity : 0.44 W/mK. CTE : 56 x 10-6 in/in/°C (below Tg). Index Of Refrection : N/A. Spectral Trans : 0.1% @ ...
Manufactured by:Epoxy Technology, Inc. based inBillerica, MASSACHUSETTS (USA)
EPO-TEK E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other heat cures can be ...
Manufactured by:Epoxy Technology, Inc. based inBillerica, MASSACHUSETTS (USA)
A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized. Higher viscosity version of EPO-TEK ...