KLA - Model C30x -Broadband Plasma Patterned Wafer Defect Inspection System
The C30x Series broadband plasma optical defect inspectors enable systematic defect discovery and latent reliability defect detection for chip manufacturing for the automotive, IoT, 5G, consumer electronics and industrial (military, aerospace, medical) markets.
The C30x inspectors leverage a tunable broadband illumination source, advanced optics and a low noise sensor to capture critical defects across a range of process layers and device types. NanoPoint™ technology focuses inspection on pattern areas at high risk for reliability failures, delivering actionable defect data that helps reduce die underkill and overkill. Through discovery of systematic defects, the C30x inspectors help accelerate characterization and optimization of new processes, design nodes and devices during R&D. In production, the C30x systems’ high sensitivity at optical inspection speed enable inline monitoring for critical process layers, helping fabs avoid defect excursions that affect final chip quality. The C30x inspectors are built on an extendible, configurable platform, supporting both 200mm and 300mm wafer sizes.
- Defect discovery, Hotspot discovery, Process debug, Engineering analysis, Line monitoring, Process window discovery
The C30x broadband plasma inspectors include the following technologies:
Broadband plasma illumination sourceWith a high brightness DUV/UV/visible light source, the C30x Series inspectors attain increased signal to critical defects.
Tunable wavelength bandsNumerous wavelength bands offer the operational flexibility required to achieve optimal contrast for different process layers and device types.
Multiple pixelsThe C30x includes small pixel sizes, enabling detection of the tiny, critical defects that affect device yield and reliability.
High data rate sensorWith a low noise, high data rate sensor, the C30x achieves high speed operation, enabling fabs to increase their inspection capacity.
Selectable Optical AperturesMultiple apertures on the C30x provide enhanced nuisance suppression, enabling detection of defects in challenging die areas.
NanoPoint™NanoPoint technology focuses inspection on micro pattern care areas at high risk for reliability failures, delivering actionable defect data that helps reduce die under/overkill.
Advanced AlgorithmsCustom defect detection algorithms suppress noise related to pattern or process variations, increasing capture of critical yield and reliability defects.
Automatic Defect BinningThrough real time binning of defects, the C30x Series accelerates time to an actionable defect Pareto and helps fab engineers focus on the most critical defect issues.