Chemical Newtech - Model PCB - Fill Copper Plating
From Anodes for Oxygen
In the working stage of printed circuit boards there’s a copper deposition inside the holes designed to lodge the contacts of the various electronic components to the circuit board itself. This operation is very delicate and it requires a high and consistent current, that only dimensionally stable anodes are able to supply, differently from the soluble copper anodes.
Products Details
In this process a solution of Copper Sulphate and Sulphuric Acid is used, with the addition of additives to increase the penetrating power of the deposition and its evenness within the holes, which have a diameter smaller than one millimetre.
The Titanium + Iridium Oxide anode is structured in such a way to reduce the consumption of additives, which are quite expensive, through an inactive porous Oxide calibrated thickness over-coating, which hinders the large additives’ organic molecules’ migration, towards the surface of the anode and it reduces its destruction.
Chemical Newtech manufactures this type of anode, according to the client’s drawing, using the coating especially designed for the geometry, usually with stretched net, used by the various users.
Customer reviews
No reviews were found for Chemical Newtech - Model PCB - Fill Copper Plating. Be the first to review!